First slide


Available for quick delivery, OEM Vacuum Hot Press, customized for flat lamination applications including Printed Circuit Boards, Rigid Flex, Flex Circuits as well as composite material bonding applications.

OEM 140 Ton Hot Press

Technical specifications:

  • Fully enclosed Vacuum chamber capable of drawing down 29.3” Hg.
  • 23.5”x29.5” platen area
  • Thermal Fluid Heated with Cooling Capability
  • Max. operating temperature 650°F
  • Four daylights (3.5” each)
  • Optional Cold Press and Loader/Unloader